The difference between lithography machine and etching machine

Etching Relatively easier than photolithography. The lithography machine prints the pattern, and then the etching machine etches off the parts with (or without) the pattern based on the printed pattern, leaving the remaining part.

Photolithography "refers to placing a pre made photolithography plate on a wafer (or silicon wafer) coated with photoresist, and then irradiating the wafer with ultraviolet light through the photolithography plate for a certain period of time. The principle is to use ultraviolet light to deteriorate some of the photoresist, making it prone to corrosion.

Etching "is the process of using etching solution to remove the deteriorated portion of photoresist (positive photoresist) after photolithography, revealing the semiconductor device and its connected patterns on the surface of the wafer. Then use another etching solution to corrode the wafer, forming semiconductor devices and their circuits.

Additional Information:

Photolithography machines are generally divided into three types based on their ease of operation: manual, semi-automatic, and fully automatic

1. Manual: refers to the adjustment method of alignment, which is achieved by manually adjusting the knob to change its X-axis, Y-axis, and theta angle to complete alignment. The alignment accuracy can be imagined to be low;

2. Semi automatic: refers to the alignment that can be adjusted and positioned by the electric axis based on the CCD;

3. Automatic: Refers to the process of uploading and downloading from substrates, with exposure duration and cycles controlled by programs. Automatic lithography machines are mainly used to meet the processing capacity requirements of factories.